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Adhesives

Adhesive bonding of zinc alloy diecastings is not commonly used as a production technique, however zinc alloys are as easy to bond as other metals and there is nothing to prevent the technique being used if desired. Bonded joints should be designed to develop shear and avoid tensile stresses in the adhesive. The surfaces to be bonded must be suitably treated before the adhesive is applied. Wide-ranging methods of surface pre-treatment exist for the various materials to be bonded. In every case, contaminants such as oil, grease and plasticizers, etc. must be removed with suitable cleaning agents. The best advice is to consult with a reputable adhesive manufacturer concerning the design of joints, the surface preparation required and the most suitable adhesive for the proposed application. A rough guide to the adhesive systems that might be suitable for bonding zinc diecastings to each other or to other materials can be gained from the tables below.

Adhesive

Substrate

Metal

PS foam

PU foam

PVC foam

Glass

Wood

Acrylic

Acrylic anaerobic

Cyanoacrylate

Epoxy

Polychloroprene

Nitrile Rubber

Phenol Formaldehyde

Polyamide

Saturated Polyester

Unsaturated Polyester

Polysulfide

Polyurethane

Silicone

Styrene Butadiene Rubber

very good
good
suitable

Source SpecialChem4Adhesives – Adhesion Guide

Adhesives Thermoplastic Substrates
Acrylic PA PC SP PE PP PS PTFE PVC
flexible
PVC
rigid
Acrylic
Acrylic anaerobic
Cyanoacrylate
Epoxy
Polychloroprene
Nitrile Rubber
Phenol Formaldehyde
Polyamide
Saturated Polyester
Unsaturated Polyester
Polysulfide
Polyurethane
Silicone
Styrene Butadiene Rubber
very good
good
suitable
Source :
SpecialChem4Adhesives – Adhesion Guide
Adhesives Thermoset and Rubber Substrates
NR CR NBR PU Si UP Ep
Acrylic
Acrylic anaerobic
Cyanoacrylate
Epoxy
Polychloroprene
Nitrile Rubber
Phenol Formaldehyde
Polyamide
Saturated Polyester
Unsaturated Polyester
Polysulfide
Polyurethane
Silicone
Styrene Butadiene Rubber
 very good
good
suitable
Source :
SpecialChem4Adhesives – Adhesion Guide

Reference 2

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Reference 23